Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
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| Autor: | Zhang, Hengyun (Shanghai University of Engineering Science, China); Che, Faxing (Institute of Microelectronics (IME), Ag |
| Nakladatel: | Elsevier Science & Technology |
| ISBN: | 9780081025321 |
| Rok vydání: | 2019 |
| Jazyk : | Angličtina |
| Vazba: | Paperback / softback |
| Počet stran: | 434 |
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