Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
4241 Kč
Sleva až 70% u třetiny knih
Nakladatel: | John Wiley And Sons Ltd |
ISBN: | 9781119314134 |
Rok vydání: | 2019 |
Jazyk : | Angličtina |
Vazba: | Hardback |
Počet stran: | 576 |
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