A Method for the Assembly of Microelectronic Packages using Microwave Curing.
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In this work a novel method for the assembly of microelectronic packages is described, which applies microwaves for the curing of adhesives. This comprises the conception and realization of a microwave curing system, based on an open-ended waveguide resonator and a prototype machine integrating the curing system. Extensive evaluation and testing reveal distinct benefits of the proposed method.
| Autor: | Adamietz, Raphael |
| Nakladatel: | Fraunhofer Verlag |
| Rok vydání: | 2018 |
| Jazyk : | Angličtina |
| Vazba: | Paperback / softback |
| Počet stran: | 244 |
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