Fan-Out Wafer-Level Packaging
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This comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging.
| Autor: | Lau, John H. |
| Nakladatel: | Springer Verlag, Singapore |
| ISBN: | 9789811088834 |
| Rok vydání: | 2018 |
| Jazyk : | Angličtina |
| Vazba: | Hardback |
| Počet stran: | 303 |
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