Wafer-Level Chip-Scale Packaging
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Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling.
| Autor: | Qu, Shichun; Liu, Yong |
| Nakladatel: | Springer-Verlag New York Inc. |
| ISBN: | 9781493954384 |
| Rok vydání: | 2016 |
| Jazyk : | Angličtina |
| Vazba: | Paperback / softback |
| Počet stran: | 322 |
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